CVE-2016-2063 | BDVDB-2026-77623 Detail

Description#

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Impact#

No impact statement in the source data.

Weaknesses#

No weakness recorded in the source data.

References#

http://www.securityfocus.com/bid/92381
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063

Exploit#

No public exploit known

History#

Version 12016-08-07Record published in the CVE List.
Version 22024-08-05Most recent update recorded in the CVE List.