Vulnerabilities

CVE-2023-22383 | BDVDB-2026-218463 Detail

QualcommSnapdragon

Description#

Memory Corruption in camera while installing a fd for a particular DMA buffer.

Impact#

Per CVSS v3.1: confidentiality impact high, integrity impact high, availability impact high. Attack vector: local.

Weaknesses#

CWE-416 Use After Free

References#

https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin

Exploit#

No public exploit known

History#

Version 12023-12-05Record published in the CVE List.
Version 22024-08-02Most recent update recorded in the CVE List.

Published

Published: 2023-12-05
Last modified: 2024-08-02

Vendor information

Vendor: Qualcomm
Product: Snapdragon

All Qualcomm vulnerabilities

Score

6.7 Medium

EPSS

less than 1%, Very Low

Estimated chance of exploitation in the next 30 days. EPSS percentile: 3.4.

KEV

No

Not listed in the CISA Known Exploited Vulnerabilities catalog.

Impact

Memory Corruption

Action

No specific action is recorded in the source data. Check the references for vendor guidance.

Affected Systems

Vulnerable
AQT1000
Fixed
Not stated
Vulnerable
C-V2X 9150
Fixed
Not stated
Vulnerable
FastConnect 6200
Fixed
Not stated
Vulnerable
FastConnect 6700
Fixed
Not stated
Vulnerable
FastConnect 6800
Fixed
Not stated
Vulnerable
FastConnect 6900
Fixed
Not stated
Vulnerable
QAM8295P
Fixed
Not stated
Vulnerable
QCA6391
Fixed
Not stated

Scoring System

CVSS v4.0

Not available

CVSS v3.1

6.7 Medium

CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

Metric breakdown
Attack Vector	Local
Attack Complexity	Low
Privileges Required	High
User Interaction	None
Scope	Unchanged
Confidentiality	High
Integrity	High
Availability	High

CVSS v3.0

Not available

CVSS v2

Not available

Source: CVE List v5 (record); CISA KEV (kev, action); FIRST EPSS (epss).