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Vulnerabilities

CVE-2022-25334 | BDVDB-2026-214537 Detail

Texas InstrumentsOMAP

Description#

The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.

Impact#

Per CVSS v3.1: confidentiality impact high, integrity impact high, availability impact high. Attack vector: local.

Weaknesses#

  • CWE-121 Stack-based Buffer Overflow

References#

Exploit#

No public exploit known

History#

  1. Version 1Record published in the CVE List.
  2. Version 2Most recent update recorded in the CVE List.