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Vulnerabilities

CVE-2022-25686 | BDVDB-2026-184652 Detail

QualcommSnapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Description#

Memory corruption in video module due to buffer overflow while processing WAV file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Impact#

Per CVSS v3.1: confidentiality impact low, integrity impact low, availability impact low. Attack vector: network.

Weaknesses#

No weakness recorded in the source data.

References#

Exploit#

No public exploit known

History#

  1. Version 1Record published in the CVE List.
  2. Version 2Most recent update recorded in the CVE List.