CVE-2022-1602 | BDVDB-2026-184262 Detail

HP ThinPro OS

Description#

A potential security vulnerability has been identified in HP ThinPro 7.2 Service Pack 8 (SP8). The security vulnerability in SP8 is not remedied after upgrading from SP8 to Service Pack 9 (SP9). HP has released Service Pack 10 (SP10) to remediate the potential vulnerability introduced in SP8.

Impact#

No impact statement in the source data.

Weaknesses#

No weakness recorded in the source data.

References#

https://support.hp.com/us-en/document/ish_6415074-6415171-16/hpsbhf03789

Exploit#

No public exploit known

History#

Version 12022-09-13Record published in the CVE List.
Version 22024-08-03Most recent update recorded in the CVE List.