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BDVDB
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Vulnerabilities

CVE-2019-14030 | BDVDB-2026-131663 Detail

QualcommSnapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking

Description#

The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130

Impact#

No impact statement in the source data.

Weaknesses#

No weakness recorded in the source data.

References#

Exploit#

No public exploit known

History#

  1. Version 1Record published in the CVE List.
  2. Version 2Most recent update recorded in the CVE List.