CVE-2017-18305 | BDVDB-2026-108697 Detail

QualcommSnapdragon Mobile, Snapdragon Wear

Description#

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

Impact#

No impact statement in the source data.

Weaknesses#

No weakness recorded in the source data.

References#

Exploit#

No public exploit known

History#

Version 12018-10-23Record published in the CVE List.
Version 22024-08-05Most recent update recorded in the CVE List.

Published

Published: 2018-10-23
Last modified: 2024-08-05

Vendor information

Vendor: Qualcomm
Product: Snapdragon Mobile, Snapdragon Wear

All Qualcomm vulnerabilities

Score

No score available.

EPSS

less than 1%, Very Low

Estimated chance of exploitation in the next 30 days. EPSS percentile: 14.5.

KEV

Not listed in the CISA Known Exploited Vulnerabilities catalog.

Impact

Not classified

Action

No specific action is recorded in the source data. Check the references for vendor guidance.

Affected Systems

Vulnerable
MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835
Fixed
Not stated

Scoring System

CVSS v4.0

Not available

CVSS v3.1

Not available

CVSS v3.0

Not available

CVSS v2

Not available

Source: CVE List v5 (record); CISA KEV (kev, action); FIRST EPSS (epss).